One Part Epoxy Adhesive
DeepMaterial One Part Epoxy Adhesive
DeepMaterial’s One Part Epoxy Adhesive is a type of adhesive that consists of a single component. This adhesive is designed to cure and form a strong bond at room temperature or with the application of heat.
DeepMaterial’s One Part Epoxy Adhesives are based on epoxy resin, which is a highly versatile and durable polymer. The adhesive is formulated with a curing agent or catalyst that remains dormant until it is exposed to specific conditions, such as air, moisture, or heat. Once activated, the curing agent initiates a chemical reaction with the epoxy resin, resulting in the cross-linking of polymer chains and the formation of a strong, durable bond.
Advantages of One Part Epoxy Adhesive
Convenience: These adhesives are ready to use straight from the container, eliminating the need for precise mixing of different components. This makes them easier to handle and reduces the chances of incorrect mixing ratios.
Time-saving: The adhesive cures at room temperature or with minimal heat application, allowing for faster assembly and production processes compared to adhesives that require longer curing times or curing at elevated temperatures.
Excellent bonding strength: The adhesives provide high bonding strength on a wide range of substrates, including metals, plastics, ceramics, and composites. They offer excellent shear, peel, and impact resistance, resulting in durable and long-lasting bonds.
Temperature resistance: These adhesives exhibit good resistance to elevated temperatures, maintaining their bond strength and stability even in high-temperature environments. They can withstand thermal cycling and offer reliable performance across a wide temperature range.
Chemical resistance: The adhesives are resistant to various chemicals, solvents, and environmental factors, making them suitable for applications where exposure to harsh chemicals or environmental conditions is expected.
Versatility: One Part Epoxy Adhesives find applications in various industries, including automotive, aerospace, electronics, construction, and general manufacturing. They are used for bonding components, sealing joints, encapsulating electronics, and repairing damaged items.
One Part Epoxy Adhesive Applications
One Part Epoxy Adhesives have a wide range of applications across various industries. include:
Automotive industry: These adhesives are used for bonding components in automotive assembly, such as attaching trim pieces, bonding plastic or metal parts, and securing electrical components.
Electronics industry: The adhesive is used for encapsulating and bonding electronic components, sealing circuit boards, potting connectors, and bonding heat sinks.
Aerospace industry: These adhesives are utilized for bonding composite materials, metal structures, and interior components in aircraft manufacturing. They are also used for repairing aircraft parts.
Construction industry: The adhesive find application in the construction sector for bonding concrete, stone, ceramic tiles, and other building materials. They are used for structural bonding, anchoring, and repairing concrete structures.
General manufacturing: These adhesives are used in various manufacturing processes, including bonding of metal parts, securing inserts or fasteners, bonding plastic components, and general assembly applications.
Marine industry: One Part Epoxy Adhesives are suitable for bonding and repairing boat hulls, decks, and other marine components. They provide excellent resistance to water, salt, and marine environments.
Electrical industry: These adhesives are used for bonding and insulating electrical components, potting transformers, securing wires and cables, and encapsulating electronic assemblies.
Medical industry: The adhesive find applications in medical device manufacturing, such as bonding medical equipment, assembling surgical instruments, and securing components in medical devices.
DIY and household applications: These adhesives are commonly used for various DIY projects and household repairs, such as bonding metal, plastic, wood, ceramics, and glass.
DeepMaterial adheres to the research and development concept of “market first, close to the scene”, and provides customers with comprehensive products, application support, process analysis and customized formulas to meet customers’ high-efficiency, low-cost and environmental protection requirements.
One Part Epoxy Adhesive Product Selection
| Product Seriess | Product name | Product typical application |
| Chip Bottom Filling |
DM-6180 | Low-temperature curing epoxy adhesive series products are designed for the bonding and fifixation of temperature sensitive devices. They can be cured at as low as 80 ℃ and have good adhesion to a variety of materials in a relatively short time.Typical applications: bonding of IR fifilter and base, and bonding of base and substrate. |
| DM-6307 | An epoxy primer, which can realize rapid curing at a relatively low temperature and minimize the stress on other parts. After curing, it can provide excellent mechanical properties and protect solder joints under thermal cycling conditions. Suitable for BGA/CSP packaging chip bottom fifilling protection. | |
| DM-6320 | The bottom fifiller is specially designed for BGA/CSP packaging process. It can rapidly solidify at appropriate temperature to reduce the thermal stress of the chip and improve the reliability of the solder joint under cold and hot cycling conditions. | |
| DM-6308 | A one-component epoxy primer for the manufacture of LED splicing screen in COB packaging process. The product has low viscosity, good adhesion and high bending strength, which can quickly and effffectively fifill the tiny gap between chips and effffectively enhance the reliability of chip mounting. | |
| DM-6303 | A one-component epoxy primer for the manufacture of LED splicing screen in COB packaging process. The product has low viscosity, good adhesion and high bending strength, which can quickly and effffectively fifill the tiny gap between chips and effffectively enhance the reliability of chip mounting. | |
Sensitive Devices |
DM-6109 | Low-temperature curing epoxy adhesive series products are designed for the bonding and fifixation of temperature sensitive devices. They can be cured at as low as 80 ℃ and have good adhesion to a variety of materials in a relatively short time.Typical applications: bonding of IR fifilter and base, and bonding of base and substrate. |
| DM-6120 | Low-temperature curing epoxy adhesive series products are designed for the bonding and fifixation of temperature sensitive devices. They can be cured at as low as 80 ℃ and have good adhesion to a variety of materials in a relatively short time.Typical applications: bonding of IR fifilter and base, and bonding of base and substrate. | |
| Chip Edge Fill | DM-6310 | An epoxy primer, which can realize rapid curing at a relatively low temperature and minimize the stress on other parts. After curing, it can provide excellent mechanical properties and protect solder joints under thermal cycling conditions. Suitable for BGA/CSP packaging chip bottom fifilling protection. |
| LED Chip Fixed | DM-6946 | Composite epoxy resin is a product developed to meet the high-end packaging technology of LED in the market. It is suitable for various LED packaging and solidifification. After curing, it has low internal stress, strong adhesion, high temperature resistance, low yellowing, and good weather resistance. |
| NR Inductance | DM-6971 | A one-component epoxy adhesive specially designed for NR inductance coil encapsulation. The product has smooth dispensing, fast curing speed, good molding effffect, and is compatible with all kinds of magnetic particles. |
| Chip Packaging | DM-6221 | A one-component epoxy resin adhesive with low curing shrinkage, high adhesive strength and good adhesion tomany materials. It is suitable for fifilling and sealing of various precision electronic components, mainly used for fifilling and sealing of automotive sensors and on-board electronic contactors. |
| Photoelectric Product Packaging |
DM-6950 | A one-component epoxy adhesive specially designed to encapsulate the bonding structure of photoelectric products. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a short time, especially plastic products. |
Product Data Sheet of One Part Epoxy Adhesive
